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M2S010

NTD $1920

6600 Available

Description:System-on-Chip FPGAs

  • CAN:1
  • DDRController:LPDDR/DDR2/3
  • Ethernet:10/100/1000 MAC
  • Total RAM Kbit (kilobits per second):400
  • Max. GPIO (3.3V) Max:NA
  • Max. HSIO (1.89V) Max:NA
  • Hard CPU:Cortex-M3
  • I2C:2
  • LogicElements(K):12
  • MMC:No
  • Math Blocks 18x18:22
  • PCIe Lanes:1
  • Product Type:SmartFusion2
  • QSPI:No
  • SPI:2
  • Temp Max °C (degrees Celsius):100
  • Temp Min °C (degrees Celsius):-40
  • UART:2
  • USB:1 HS 2.0 OTG
  • SERDES_Speed Gbps (gigabits per second):5
  • SERDES lanes:4
  • 2.0B-compliant CAN controller
    • Microcontroller Subsystem
    • Hard 166-MHz 32-Bit ARM Cortex-M3 based SoC FPGA
    • 1.25 DMIPS/MHz
    • 256 KB embedded nonvolatile memory (eNVM)
    • DDR Controller - LPDDR/DDR2/3
    • Triple-speed Ethernet (TSE) 10/100/1000 Mbps MAC
    • USB 2.0 high speed on-the-go (OTG) controller
    • 64 KB embedded SRAM (eSRAM)
    • Two SPI ports, two I2C ports, and multi-mode UARTs
      FPGA Fabric
    • 12K logic elements
    • 22 Math blocks (18x18)
    • 2 PLLs and CCCs
    • 400K bits RAM
    • Offers design security
    • Temperature - Commercial, Industrial
      Note:
    • TQ packages do not support FDDR or MDDR.